Chinese chip firms Denglin, Xinde open mixed in Hong Kong debuts
FILE PHOTO: Semiconductor chips are seen on a printed circuit board in this illustration picture taken February 17, 2023. REUTERS/Florence Lo/Illustration/File Photo
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HONG KONG, Nov 10 : Shares of Chinese AI chip designer Suzhou Denglin Technology opened 0.9 per cent lower in their Hong Kong debut on Tuesday after the company raised HK$1.41 billion ($180 million) in an initial public offering.
Semiconductor packaging firm Jiangsu Xinde Semiconductor Technology opened 20.5 per cent higher after raising HK$946.3 million in its IPO.
Source: Reuters
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