Bosch to spin off semiconductor division in January 2028
FILE PHOTO: The Bosch logo is reflected in a semiconductor wafer in the company manufacturing base in Reutlingen, Germany, June 16, 2017. REUTERS/Michaela Rehle/File Photo
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Nov 3 : Bosch, the world’s top automotive supplier, will spin off its semiconductor division in January 2028, it said on Tuesday.
• The German firm said it aims to increase sales of the small components used in cars and e-bikes to 5 billion euros ($5.59 billion) by 2030
• Currently, the semiconductor activities are part of the Mobility Electronics division
• The firm will increasingly open its manufacturing capacities to external partners and strategically expand its foundry business, it added
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• Bosch, which relies on a network of around 40 semiconductor sites worldwide for research, development, and manufacturing, plans to further expand its test centre in Penang, Malaysia, by the middle of the 2030s
($1 = 0.8937 euros)
Source: Reuters
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